General |
Product Type |
Notebook - flip design |
Operating System |
Windows 10 Pro 64-bit Edition - English |
Processor / Chipset |
CPU |
Intel Core i7 (8th Gen) 8565U / 1.8 GHz |
Max Turbo Speed |
4.6 GHz |
Number of Cores |
Quad-Core |
Cache |
8 MB |
64-bit Computing |
Yes |
Features |
Hyper-Threading Technology, Intel Turbo Boost Technology 2.0, Intel Smart Cache, Intel Thermal Velocity Boost |
Memory |
RAM |
32 GB (provided memory is soldered) |
Technology |
DDR4 SDRAM - non-ECC |
Speed |
2400 MHz |
Rated Speed |
2666 MHz |
Storage |
Main Storage |
1 TB SSD M.2 2280 PCIe 3.0 x4 - NVM Express (NVMe), triple-level cell (TLC) |
Display |
Type |
14" - IPS |
LCD Backlight Technology |
WLED backlight |
Touchscreen |
Yes |
Resolution |
1920 x 1080 (Full HD) |
Widescreen |
Yes |
Image Aspect Ratio |
16:9 |
Image Brightness |
1000 cd/m² |
Colour Gamut |
72% NTSC |
Privacy Technology |
HP SureView |
Features |
Direct Bonding technology, privacy filter, Panel Self Refresh (PSR), Full HD eDP anti-glare, Corning Gorilla glass 5, 72% NTSC colour gamut |
Keyboard Name |
HP Premium Collaboration Keyboard |
Audio & Video |
Graphics Processor |
Intel UHD Graphics 620 |
Camera |
Yes - 1080p |
Camera Features |
IR camera, Windows Hello |
Sound |
Four speakers, 3 multi-array microphone |
Audio Features |
Bang & Olufsen Audio, 4 discrete amplifiers |
Input |
Type |
Keyboard, digital pen, ClickPad |
Keyboard Backlight |
Yes |
Keyboard Layout |
UK |
Features |
Volume control, spill-resistant, gesture function, precision touchpad, glass clickpad, Wacom Active ES technology (AES) 2.0 |
Communications |
Wireless |
Bluetooth 5.0, 802.11a/b/g/n/ac/ax |
Bluetooth Class |
Class 2 |
Wireless Controller |
Intel Wi-Fi 6 AX 200 - PCI Express Mini Card (M.2) |
Features |
Miracast |
Compliant Standards |
IEEE 802.11b, IEEE 802.11a, IEEE 802.11d, IEEE 802.11g, IEEE 802.1x, IEEE 802.11i, Wi-Fi CERTIFIED, IEEE 802.11h, IEEE 802.11e, IEEE 802.11n, IEEE 802.11k, IEEE 802.11ac, IEEE 802.11r, IEEE 802.11v, IEEE 802.11ax |
Wireless Broadband (WWAN) |
Generation |
4G |
Technology |
LTE, DC-HSPA+ |
Controller |
Intel XMM 7360 - M.2 Card |
Max Transfer Rate |
450 Mbps |
Navigation |
Receiver |
GPS/A-GPS |
Battery |
Technology |
4-cell lithium polymer |
Capacity |
56.2 Wh |
Run Time |
Up to 16 hours |
AC Adapter |
Input |
AC 120/230 V (50/60 Hz) |
Output |
65 Watt, 5 / 9 / 12 / 15 / 20 V |
Connections & Expansion |
Slots |
1 x Nano-SIM card (1 free) |
Interfaces |
2 x USB-C (supports Thunderbolt) , USB 3.1 Gen 1 (charging) , HDMI , Headphone/microphone combo jack , USB 3.1 Gen 1 |
Software |
Software Included |
HP Support Assistant, HP Hotkey Support, Windows Defender, HP Secure Erase, HP Drive Packs (free download), HP Client Catalog, HP BIOS Config Utility, HP Image Assistant, HP JumpStart, HP Noise Cancellation, HP System Software Manager, HP Connection Optimizer, HP Manageability Integration Kit Gen3, HP BIOSphere Gen5, HP Client Security Suite Gen5, HP Cloud Recovery |
Miscellaneous |
Case Material |
Aluminum |
Integrated Options |
Accelerometer, ambient light sensor, magnetometer, gyro sensor, hall sensor |
Security |
Firmware Trusted Platform Module (TPM 2.0) Security Chip, fingerprint reader |
Features |
Power-on password, HP DuraKeys, Setup Password, HP Automatic Drive Lock, HP DriveLock, Power On Authentication, Pre-boot Authentication, MU-MIMO technology, Master Boot Record Security, BIOS Update via Network |
Theft/Intrusion Protection |
Security lock slot (cable lock sold separately) |
Security Slot Type |
Kensington nano security slot |
Included Accessories |
USB-C power adapter |
Compliant Standards |
CSA, UL, VCCI, BSMI, GOST, SABS, CCC, FCC, RoHS, WEEE, A-Tick, ICES, Common Criteria EAL4+, KC, CIT, low halogen, ICCP |
Localization |
Language: English / region: United Kingdom |
Dimensions & Weight |
Dimensions (WxDxH) |
32.14 cm x 21.5 cm x 1.69 cm |
Weight |
1.35 kg |
Environmental Standards |
ENERGY STAR Certified |
Yes |
Manufacturer Warranty |
Service & Support |
Limited warranty - parts and labour - 3 years |
Environmental Parameters |
Min Operating Temperature |
0 °C |
Max Operating Temperature |
35 °C |
Shock Tolerance (operating) |
40 g @ 2 ms half-sine |
Shock Tolerance (non-operating) |
240 g @ 2 ms half-sine |
Vibration Tolerance (operating) |
1.043 g @ RMS (random) |
Vibration Tolerance (non-operating) |
3.5 g @ RMS (random) |